Enflex launches new PH-28 at PACK EXPO Chicago 2024

• Date: November 3-6, 2024 
• Location: McCormick Place Convention Center, Chicago, Illinois 
• Booth: Hall South N. S-2501 

Visit us from November 3 to 6 on the Coesia booth S-2501 (South hall), to explore over 1000 m2 of automation evolution at PACK EXPO Chicago! 

Discover the new PH-28 flat-pouching machine and attend LIVE presentations from our experts. 
This solution is designed specifically to Form-Fill-Seal high quality resistant and leak-free sachets for pharmaceutical products. Fully compliant with the industry regulations, the PH-28 features a new dosing system for fine hygroscopic powders, handling also liquids and tablets. 

Meet us
PACK EXPO Chicago 2024, November 3-6, 2024 
McCormik Place Convention Center Chicago, Illinois 
Hall South N. S-2501